o Fixing IR drop involves 1) strengthening the Power Distribution Network (PDN) to reduce its resistance or 2) reducing the current drawn by the logic.
o During
Placement/Floorplan (Preventative)
o
Robust PDN Design: Plan a dense power
grid using wide straps/rings on low-resistance metal layers with ample vias
o
Macro Placement: Place high-power macros
near power sources or ensure they have strong connections to the power grid.
o Cell
Placement: Avoid clustering high-power or high-switching activity cells in
one area. Use density controls.
o During
Post-Route Optimization / ECO Stage:
o
Strengthen
PDN:
§
Add/Widen
Power Straps: Introduce more power/ground stripes in areas with high
voltage drop or increase the width of existing straps.
§
Add Power
Vias: Increase the number of vias connecting different layers of the power
grid, at connections to cell rails, to reduce vertical resistance.
o
Add Decap
Cells (Primarily for Dynamic IR):
o
Reduce
Current Draw:
§
Cell
Downsizing: Replace high-power cells in the violating region with smaller
drive-strength equivalents, if no timing violations.
§
VT
Swapping (Higher Vt): Swap cells to higher-Vt to reduce leakage current
(helps static IR) and slightly reduce peak dynamic current (helps dynamic IR), If
no timing issues.
o
Spread
High-Activity Cells: If dynamic IR drop is caused by simultaneously
switching cells clustered together, try spreading these cells apart during ECO
placement
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