o Power
Grid Integrity: Due to lower Vdd and higher current density, the power grid
must be extremely robust. This means more metal layers allocated for power
o Pin
Placement Complexity: Higher pin counts and tighter bump pitches make I/O
pin placement challenging.
o
Increased Pin Density & Access:
Macros at 7nm often have extremely high pin densities. This requires wider
channels, careful orientation and blockages.
o Complex
DRCs:
o Timing Impact: Due to high wire resistance
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