o TSV (Through-Silicon Via): A vertical electrical connection (via) that passes completely through a silicon wafer or die. Used in 3DIC or 2.5D Chips, allowing different dies to be stacked vertically and interconnected directly using TSV and bumps.
o
Physical Definition (LEF): A TSV would be
defined in a manner similar to a standard via but with unique properties:
o
Layer Type defined as “TSV” so tool understands
it is not normal cut layer.
o
It would have specific landing and covering
layers (top and bottom metals it connects to).
o
Dimensions (diameter, pitch).
o
TSV-to-TSV or other metal spacing rules
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