o Multi-Patterning Rules: Assigning diff masks to shapes based on adjacent mask, if it is odd cycle violation, loop violation.
o
Via Rules:
o Via
Stacking & Alignment: Very tight rules on stacking multiple vias and
their alignment to metal layers above and below.
o Via
Enclosure by Metal: Stricter metal enclosure around vias.
o
Interconnect Rules:
o
Minimum Metal Pitch: Extremely tight
metal width and spacing rules.
o
End-of-Line (EOL) Spacing: Specific,
often larger, spacing required at the ends of metal lines.
o
Complex Conditional Spacing: Spacing
rules that change based on parallel run length, adjacent feature types, or
layer.
o
fixing-double-patterning-errors-at-20nm
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