o Filler Replacement: Tools often place decaps in available whitespace within standard cell rows, replacing filler cells. This is the most common method.
o Near
High-Switching Logic: Targeted placement near blocks or cells known to have
high switching activity (e.g., clock buffers, data path muxes, bus drivers).
o Around
Macros: Placing decap cells in the channel space surrounding memory macros
or other large IP blocks.
o Under
Power Straps: Some flows allow placing decap cells directly underneath
higher-level power grid straps.
o Uniform
Sprinkle: Tools often aim for a relatively uniform distribution across the
core area to provide baseline decoupling everywhere.
o Density
Target: Placement might be driven by a target decap density (e.g.,
percentage of total cell area or capacitance per unit area), often higher in
areas identified as hotspots by power analysis.
o Checkerboard/Regular
Pattern: Sometimes placed in a regular pattern (e.g., every N sites) if
specific rules or manual placement strategies are used.
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